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MECOP INTERNSHIP PROGRAM

Formerly known as the Multiple Engineering Cooperative Program. MECOP is a prestigious, paid internship program sponsored by Oregon industries. The program represents a collaborative effort between Oregon State University, Portland State University, Oregon Tech, University of Portland, and more than 150 northwest companies and municipalities. 

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The MECOP program is available to students enrolled in various disciplines relating to the engineering industry, a few of which include:

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  • Accounting

  • Chemical Engineering 

  • Civil Engineering 

  • Computer Science 

  • Electrical Engineering

  • Industrial and Manufacturing Engineering 

  • Marketing 

  • Mechanical Engineering 

  • Project Management

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Prior to internship placement, all member companies and students are required to participate in a series of events with the aim of matching interns with employers. The first of which is a social gathering/job fair to introduce students and member organizations. The second being interviews for internship placement. Each student is interviewed by a panel consisting of industry representatives looking for a student in their discipline. Following interviews, industry reps select their students through a lottery process, followed by placement announcements sent to students after the event.

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To ensure a diverse experience, participating students are required to intern at two different companies in an effort to give the students as much real-world experience as possible and to expose students to different work cultures and industries.

Internships: Text

MY INTERNSHIPS

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GENENTECH

In my first six-month internship, I worked for Genentech, a biotechnology company dedicated to pursuing groundbreaking science to discover and develop medicines for people with serious and life-threatening diseases. I worked as a mechanical design intern at Genenchtech's Hillsboro Technical Operations location. This site is home to a state-of-the-art fill/finish facility, warehousing, and distribution center. I worked primarily within the packaging department, where my main project was to design a jig that would allow for consistent placement of a mechanism on a production line machine. I also designed and 3D printed components helping to improve the efficiency of various manual processes on the production floor. Outside of the packaging department, I worked on a research and development project designing an end effector for the palatalization of products. Within aseptic operations, I designed specialized component organizers promoting 5S principles and ensuring process efficiency.

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Due to confidentiality I am unable to share my MECOP report from my time at Genentech.

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TEKTRONIX COMPONENT SOLUTIONS

In my second six-month internship, I worked for Tektronix Component Solutions (CSO), a microelectronics manufacturer that uses advanced manufacturing techniques to assemble high-performance microelectronics for government and military contracts. I worked as a mechanical design intern on the Mechanical Design Team at CSO. Our team supported the manufacturing floor in a variety of different capacities, from designing and implementing new manufacturing processes and fixturing. To retrofitting existing systems to allow for improved efficiencies. My main project involved implementing a second aligner system on the production floor. This included early design changes, bill of materials generation, vendor selection/request for quote, and Assembly. Another project I worked on was the redesign of the existing Electro-Optical Module carrier allowing for integration into existing systems while preventing lead and fiber damages. This redesign became a complex optimization problem.

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If you are interested in learning more about my experience and projects while interning at Tektronix feel free to read more in the Internship Report linked below. 

Internships: List
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